Microwave & RF PCBs

Expertise in PCB Manufacturing

Specializing in advanced materials like Ultra Low Loss FR4, Ceramic Filled, PTFE Reinforced, Teflon, Hydrocarbon, Arlon, Rogers, AGC (Nelco/Taconic), Isola, Panasonic, Shengyi, TUC, and Ventec.

Offering hybrid solutions such as PTFE+FR4 and Ceramic+FR4 combinations to meet diverse technical requirements.

Providing precision-controlled impedance down to 5%, along with advanced features like Blind & Buried Vias, Micro Vias, and HDI technologies.

Utilizing both Conductive and Non-Conductive Via Plugging for enhanced reliability and performance.

Certified to the highest industry standards with ISO9001:2015 and UL listings, ensuring top-quality PCB production.

Industries & Applications of RF PCBs

RF PCBs are integral to a diverse range of industries and applications, including:

Wireless & Communication: Essential for satellite systems, signal transmission base stations, mobile communication devices, antennas, handheld gadgets, and small cells.
Automotive Technology: Vital in advanced systems like collision avoidance, navigation, GPS, and autonomous driving radar.
Computing & Data Networks: Crucial for high-speed digital products such as servers, storage systems, routers, switches, and backplane & daughter card designs supporting 10 to 800Gbps data transmission.
RF & Microwave Systems: Key components in power amplifiers, low noise amplifiers, radio systems, and related high-frequency applications.

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Understanding Microwave & RF PCBs

Microwave & RF PCBs are specialized printed circuit boards designed for high-frequency applications. RF (Radio Frequency) PCBs are constructed using materials that support electromagnetic frequencies of 300MHz and above. When these materials handle frequencies of 1GHz or higher, the PCBs are classified as Microwave PCBs.

These advanced PCBs are crucial for high-speed electronic devices that require rapid and reliable data transmission. They are widely utilized across various industries, including wireless communication, satellite systems, signal reception, millimeter-wave technology, automotive radar, avionics, aerospace, and digital data communication systems such as servers, routers, and semiconductors.

Pros and Cons of RF PCBs

Advantages of RF (Radio Frequency) PCBs:

High-Speed and High-Frequency Capabilities:
- RF PCBs are crafted from materials with low Dk and low Df, making them ideal for high-speed data transmission and high-frequency applications.
Durability in Harsh Environments:
- Engineered to withstand extreme conditions, RF PCBs are highly durable, even in environments with high humidity. This makes them perfect for outdoor signal transmission applications.
Temperature Resistance:
- Many RF PCB materials, such as PTFE and reinforced PTFE, can endure very high temperatures, with options like TU-901 (TG180) and Arlon series (TG250) offering superior thermal stability.

Disadvantages of RF (Radio Frequency) PCBs:

High Cost:
- The use of advanced high-frequency materials makes RF PCBs more expensive. Additionally, the specialized equipment and skilled labor required for their production further increase costs.
Complex Manufacturing Process:
- RF PCBs often use reinforced FR4, ceramic, or PTFE materials, which are more challenging to process than standard FR4 laminates. For example, ceramic is fragile, and PTFE is flexible, both requiring specialized techniques and equipment.
Significant Investment:
- Manufacturing RF PCBs necessitates advanced equipment, including plasma hole cleaning systems, precise lamination machinery, high-accuracy etching lines, and specialized profiling machines, leading to higher investment costs compared to standard PCB production.

Key Properties of RF PCB Materials

Dielectric Constant (ε):
- A higher dielectric constant leads to greater signal loss, shorter wavelengths, and narrower circuit widths. Keep in mind that the actual dielectric constant may be slightly higher than the manufacturer’s specifications.
Loss Tangent (Tanθ):
- Ideally, the loss tangent should be as low as possible. A higher tangent increases signal loss, but its impact on circuit width is minimal and generally negligible.
Substrate Thickness:
- Thicker substrates result in reduced signal loss, but also lead to wider circuit widths, particularly at longer wavelengths.
Frequency:
- As frequency increases, so does signal loss. Higher frequencies result in shorter wavelengths, requiring narrower circuit widths.
Copper Foil Thickness:
- Thicker copper foils increase signal loss, but their effect on circuit width is minor and often negligible.

Critical Considerations for RF & Microwave Materials:

Signal Loss Tolerance: Ensuring minimal signal loss is crucial for high-performance RF applications.
Heat Dissipation: Effective thermal management is essential for maintaining performance and longevity.
Cost Efficiency: Balancing material properties with cost is key to optimizing product value.
Operational Temperature: Materials must withstand the required operational temperatures without degrading.
Soldering and Assembly Temperatures: RF materials should handle high temperatures during soldering and assembly without compromising integrity.

Diverse RF PCB Materials: Rogers, Arlon, Nelco, More

Some of the Different RF PCB Material Types that We Work with Are:

The RF PCB material types that we work with are materials supplied by Rogers, Arlon, Nelco, Taconic, EMC, TUC, etc.
Normally Used Materials in RF PCB

BRAND	TYPE	DK	DF	CHARACTERISTIC
Rogers	RO4350B	3.48	3.48	Hydrocarbon/Ceramic/Woven Glass
Rogers	RO4403C	3.38	0.0027	Hydrocarbon/Ceramic/Woven Glass
Rogers	RO3003	3.0	0.0010	PTFE Ceramic
Rogers	RT/duroid 5880	2.20	0.0009	PTFE Random Glass Fiber
Rogers	RT/duroid 5870	2.33	0.0012	PTFE Random Glass Fiber
Rogers	RT/duroid 6002	2.94	0.0012	PTFE Ceramic
Rogers	RT/duroid 6006	6.15	0.0027	PTFE Ceramic
Rogers	RT/duroid 6010	10.20	0.0023	PTFE Ceramic
Rogers	RO3203	3.02	0.0016	Fiberglass Reinforced/PTFE Ceramic
Rogers	RO3035	3.50	0.0015	PTFE Ceramic
Rogers	RO3006	6.15	0.002	PTFE Ceramic
Rogers	RO3010	10.20	0.0022	PTFE Ceramic
Rogers	RO3210	10.20	0.0027	Fiberglass Reinforced/PTFE Ceramic
Rogers	RO4830	3.25	0.0033	Hydrocarbon/Ceramic/Woven Glass
Rogers	AD250C	2.50	0.0013	Fiberglass Reinforced PTFE
Rogers	AD255C	2.55	0.0013	Fiberglass Reinforced PTFE
Rogers	AD300D	2.97	0.0021	Fiberglass Reinforced PTFE
Rogers	AD350A	2.50	0.0033	Fiberglass Reinforced PTFE
Rogers	CuClad 217	2.17	0.0009	Fiberglass Reinforced PTFE
Rogers	Cuclad 233	2.33	0.0013	Fiberglass Reinforced PTFE
Rogers	CuClad 250	2.50	0.0017	Fiberglass Reinforced PTFE
Rogers	DiClad 880	2.17	0.0009	Fiberglass Reinforced PTFE
Rogers	DiClad 870	2.33	0.0013	Fiberglass Reinforced PTFE
Rogers	DiClad 527	2.40	0.0017	Fiberglass Reinforced PTFE
Rogers	TC350	3.50	0.0020	Fiberglass Reinforced/PTFE Ceramic
Rogers	TC350 Plus	3.50	0.0017	Fiberglass Reinforced/PTFE Ceramic
Rogers	TC600	6.15	0.0020	Fiberglass Reinforced/PTFE Ceramic
Rogers	TMM 3	3.45	0.0020	Hydrocarbon Ceramic
Rogers	TMM 4	4.7	0.0020	Hydrocarbon Ceramic
Rogers	TMM 6	6.3	0.0023	Hydrocarbon Ceramic
Rogers	TMM 10	9.8	0.0022	Hydrocarbon Ceramic
Rogers	TMM 10i	9.9	0.0020	Hydrocarbon Ceramic
Rogers	TMM 13i	12.2	0.0019	Hydrocarbon Ceramic
Rogers	IsoClad 917	2.17	0.0013	Non-Fiberglass Reinforced PTFE
Rogers	IsoClad 933	2.33	0.0016	Non-Fiberglass Reinforced PTFE
Rogers	Kappa 438	4.1	0.005	Hydrocarbon/Ceramic/Woven Glass
Rogers	RO1200	3.03	0.0017	Fiberglass Reinforced/PTFE Ceramic
Panasonic	MEGTRON 6	3.4	0.002	Ultra-low Loss/Highly Heat Resistant
Panasonic	MEGTRON 7	3.35	0.002	Ultra-low Loss/Highly Heat Resistant
ISOLA	TACHYON® 100G	3.02	0.0021	Ultra Low Loss for high-speed products
ISOLA	ASTRA® MT77	3.0	0.0017	Ultra Low Loss for RF/MW products
ISOLA	I-TERA® MT40	3.45	0.0031	Very Low-Loss for high speed products
ISOLA	TERRAGREEN	3.44	0.0039	Very Low Loss/Halogen free laminate
ISOLA	I-SPEED®	3.64	0.006	Low Loss/max. thermal performance
ISOLA	IS680AG	3.0	0.0020	Very Low-Loss for RF/ microwave
AGC	EZ-IO-F	2.8	0.0015	Used for Spread weave with PTFE
AGC	NF-30	3.0	0.0013	Ceramic-filled PTFE
AGC	RF-10	10.2	0.0025	Low loss, high DK
AGC	RF-30A	2.97	0.002	Use for antenna material
AGC	RF-35HTC	3.5	0.0007	High thermal conductivity
AGC	RF-35TC	3.5	0.002	Thermally conductive low loss
AGC	RF-35TC-A	3.5	0.002	Thermally conductive low loss
AGC	RF-60TC	6.15	0.002	Very good thermal conductivity
AGC	TLF-35A	3.5	0.0026	PA material/low loss
AGC	TSM-DS3	3.0	0.0014	Dimensionally stable low loss
AGC	TSM-DS3b	3.0	0.0014	Dimensionally stable low loss
AGC	TSM-DS3M	2.94	0.0014	Dimensionally stable low loss
AGC	TLC-32	3.2	0.003	Low cost RF
AGC	TLE-95	2.95	0.0026	Thin dielectric base material
AGC	TLX-8	2.95	0.0018	High volume antenna
AGC	TLX-5	2.2	0.0009	Very low DK
AGC	TLY-5A	2.17	0.0009	Very low DK
AGC	TLY-5Z	2.2	0.0015	Low DK, low Z axis
AGC	N4000-13	3.6	0.009	Modified Epoxy
AGC	N4000-13 EP	3.6	0.009	Modified Epoxy
AGC	N4000-13 EP SI	3.2	0.008	Modified Epoxy
AGC	N4000-13 SI	3.2	0.008	Modified Epoxy
AGC	N7000-2 HT	3.5	0.009	Non-MDA Toughened PTFE
AGC	N7000-3	3.5	0.009	Toughened PTFE
AGC	Mercurywave 9350	3.55	0.004	Modified Epoxy
AGC	Meteorwave 1000	3.5	0.0047	Low Loss PPE material
AGC	Meteorwave 1000NF	3.4	0.0047	Very Low Loss/No Flow laminate
AGC	Meteorwave 2000	3.4	0.0034	PPE with Extreme Low Loss PPE material
AGC	Meteorwave 3000	3.2	0.0039	Low Loss PPE material
AGC	Meteorwave 3350	3.6	0038	Low Loss PPE/High Speed
AGC	Meteorwave 4000	3.50	0.0024	PPE with Extreme Low Loss PPE material
AGC	Meteorwave 4000M	3.4	0.0020	PPE with Extreme Low Loss PPE material
AGC	Meteorwave 5000 HF	3.2	0.0033	Very Low Loss PPE/Halogen Free
AGC	Meteorwave 5000 HF	3.4	0.0022	Very Low Loss PPE/Halogen Free
AGC	Meteorwave 8000	3.2	0.0016	PPE with Extreme Low Loss PPE material
AGC	Meteorwave 8300	3.0	0.0025	PPE with Extreme Low Loss PPE material
AGC	Meteorwave 8350	3.5	0.0018	PPE with Extreme Low Loss PPE material
Ventec	tec-speed 7.0H	3.5	0.005	Ultra low loss/ high thermal reliability
Ventec	tec-speed 7.1	3.1	0.002	Ultra low loss/ high thermal reliability
Ventec	tec-speed 6.0H	3.5	0.005	Very Low Loss Excellent Thermal Reliability
Ventec	tec-speed 6.0	3.5	0.005	Low Dk / very low Loss / Tg 170
Ventec	tec-speed 5.0	3.5	0.006	Halogen Free & SLP
Ventec	tec-speed 4.0	3.8	0.007	Mid Dk / lower Loss / Tg 190
Ventec	tec-speed 3.0	3.7	0.0075	Mid Dk / low Loss / Tg 175 Halogen Free
Ventec	tec-speed 2.1	3.7	0.0095	Mid Dk / low Loss / Tg 175 Halogen Free
Ventec	tec-speed 2.0	3.8	0.0095	Mid Dk /mid Loss / Tg 180 Halogen Free
Ventec	VT-6710	10.2	0.0022	Dk 10.2 ceramic-filled PTFE composite
Ventec	VT-6702	2.94	0.0011	Dk 2.94 ceramic-filled PTFE composite
Ventec	VT-3703	3.0	0.0099	Dk 3.0 ceramic-filled PTFE
Ventec	VT-3706	6.15	0.0019	Dk 6.15 ceramic-filled PTFE
Ventec	VT-870 L330	3.3	0.0025	Dk 3.0-3.48 ceramic-filled hydrocarbon
Ventec	VT-870 H348 TCR	3.48	0.0037	Laminate with Ticer Thin-Film Resistor Foils
Arlon	33N	4.1	0.01	Flame Retardant Polyimide with TG250
Arlon	35N	4.1	0.01	Flame Retardant Polyimide with TG250
Arlon	85N	4.1	0.01	High Temperature (TG250) Polyimide
Arlon	85HP	4.2	0.009	High Temperature (TG250) Polyimide
Arlon	38N	4.25	0.01	2nd Gen Low Flow Polyimide Prepreg
TUC	TU662	4.3	0.014	Mid-Tg and High Thermal Reliability
TUC	TU662F	4.7	0.018	Mid-Tg and High Thermal Reliability
TUC	TU668	4.3	0.014	Mid-Tg and High Thermal Reliability
TUC	TU772	4.2	0.016	High-Tg Thermal Resistance
TUC	TU768	4.3	0.018	High-Tg and High Thermal Reliability
TUC	TU768F	4.4	0.018	High-Tg and High Thermal Reliability
TUC	TU-862 HF	4.4	0.01	Very Low CTE
TUC	TU-862T	4.5	0.013	High Tg Halogen Free low loss
TUC	TU865	4.3	0.01	Mid loss Tg 200°C Halogen Free
TUC	TU-747T	3.6	0.012	Mid loss Halogen free
TUC	TU-747 LK	3.3	0.011	Low and stable Dk/Df Halogen free
TUC	TU-742 LF	4.4	0.01	Low CTE
TUC	TU-862S	4.3	0.011	Low Dk/ Df and Midium loss
TUC	TU-862T	4.5	0.013	Very Low CTE
TUC	TU-865	4.3	0.01	Mid loss Tg 200°C Halogen Free
TUC	TU-787 LK	3.4	0.009	Low and stable Dk/Df
TUC	TU-872	3.8	0.009	Low Dk/Df and High Thermal Reliability
TUC	TU-872 SLK	3.8	0.009	Low Dk/Df and High Thermal Reliability
TUC	ThunderClad 1	3.9	0.0095	High temperature/Halogen free Low Dk & Df
TUC	ThunderClad 1+	4.0	0.007	High temperature/Halogen free Low Dk & Df
TUC	TU-872 SLK Sp	3.5	0.008	Low Dk/Df and High Thermal Reliability
TUC	TU-900	3.7	0.0055	Low loss g 260°C Halogen Free
TUC	TU-901	3.5	0.0038	Tg 280°C Halogen Free Ultra-Low loss
TUC	ThunderClad 2C	3.57	0.0046	Very Low Loss and High Thermal Reliability
TUC	ThunderClad 2	3.57	0.0046	Stable and flat Dk/Df performance
TUC	ThunderClad 2A	3.64	0.0026	Very Low Loss and High Thermal Reliability
TUC	ThunderClad 3E	3.5	0.0036	Very Low Loss and High Thermal Reliability
TUC	Content	3.64	0.0035	Very Low Loss and High Thermal Reliability
TUC	ThunderClad 2 Sp	3.22	0.0029	Very Low Loss and High Thermal Reliability
TUC	ThunderClad 2A Sp	3.25	0.0019	Super Low Loss/High Thermal Reliability
TUC	ThunderClad 3	3.4	0.0025	Super Low Loss/High Thermal Reliability

BRAND	TYPE	DK	DF	CHARACTERISTIC
TUC	ThunderClad 3+	3.16	0.0021	Super Low Loss/High Thermal Reliability
TUC	ThunderClad 400G	3.25	0.0018	Super Low Loss/High Thermal Reliability
TUC	ThunderClad 4N	3.22	0.0017	Extreme Low Loss/High Thermal Reliability
TUC	ThunderClad 4R	3.22	0.0015	Extreme Low Loss/High Thermal Reliability
TUC	ThunderClad 4SN	3.22	0.0015	Extreme Low Loss/High Thermal Reliability
TUC	ThunderClad 4SR	3.22	0.0014	Extreme Low Loss/High Thermal Reliability
TUC	PegaClad 1	3.59	0.0031	Very Low Loss and High Thermal Reliability
TUC	PegaClad 2	3.31	0.0019	Super Low Loss/High Thermal Reliability
TUC	PegaClad 2A	3.04	0.0016	Super Low Loss/High Thermal Reliability
TUC	PegaClad 300	3.05	0.0018	Very Low Loss and High Thermal Reliability
SHENGYI	SG7350D	3.50	0.0019	Thermal Conductive RF
SHENGYI	SG7350D2	3.50	0.0019	Thermal Conductive RF
SHENGYI	Synamic 6B(F)	3.56	0.0036	RF used bonding prepreg
SHENGYI	mmWave77	3.0	0.001	Low low high frequency
SHENGYI	SCGA-500 GF220	2.20	0.0009	PTFE with Woven Glass Reinforced
SHENGYI	SCGA-500 GF255	2.55	0.0014	PTFE with Woven Glass Reinforced
SHENGYI	SCGA-500 GF265	2.65	0.0017	PTFE with Woven Glass Reinforced
SHENGYI	SCGA-500 GF300	3.00	0.0023	PTFE with Woven Glass Reinforced
SHENGYI	SNB33	3.30	0.0025	Glass reinforced Hydrocarbon Ceramic
SHENGYI	S7136H	3.42	0.0030	Glass reinforced Hydrocarbon Ceramic

Distinguishing Between High-Speed PCB and High-Frequency PCB

While high-speed and high-frequency PCBs may seem similar, they cater to different requirements. High-speed PCBs handle high-speed signal traces, while high-frequency PCBs manage high-frequency signals.

High-Speed PCBs: A PCB is typically classified as high-speed if it exhibits the following characteristics:

Signal frequency exceeds 50MHz.
Signal rise/fall time is under 50 picoseconds.
Signal transmission length is greater than 1/6 of the wavelength (λ).
Signal transmission experiences minimal skin effects and ionization loss.

High-Frequency PCBs: High-frequency PCBs generally manage a single high-frequency signal, while high-speed PCBs may handle multiple high-speed signals with varying timing and frequency. High-frequency signals are analog with higher transmission speeds, whereas high-speed signals are digital and also possess high transmission rates.

Key Tips for RF PCB Manufacturing

Manufacturing RF PCBs requires advanced technology, skilled workers, and the right equipment. Here are some essential considerations:

Drilling Process: Use new drill bits and protect the panel by covering it with aluminum sheets on both sides to prevent damage to the vias, especially when working with PTFE materials.
Solder Mask Application: Avoid panel scabbing and apply the solder mask twice to prevent bubbles and ensure a smooth finish.
Baking Before HASL Treatment: Bake the PCBs at 150 degrees Celsius for 30 minutes before the Hot Air Solder Leveling (HASL) process to ensure stability.
Etching Tolerance: Maintain tight control over etching tolerance, ideally within +/- 0.05mm, or according to the customer’s specifications.
Panel Size Consideration: Optimize material utilization by using an 18*24’’ panel size, as RF PCB materials are costly.

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Essential Insights for RF PCB Stackup and Design

What Constitutes an Ideal RF PCB Stackup?

An optimal RF PCB stackup typically includes at least one microwave and RF dielectric material, such as Rogers RO4350, RO4003, or RO3003. For instance, a 4-layer RF PCB might use RO4350 for layers 1 and 4, with FR4 in the middle layers 2 and 3, ensuring both performance and cost efficiency.

How to Select the Right RF PCB Material?

The key to selecting RF PCB material is ensuring that the dielectric constant (DK) and dissipation factor (DF) align with your device’s electromagnetic frequency requirements. Opt for commonly used materials like Rogers RO4350B, RO4003C, or Panasonic MEGTRON 6 and 7 for reliable performance.

Getting Started with RF PCB Design

Start by understanding the function and application of your device. Then, design the circuit diagram and generate Gerber files for PCB fabrication, along with a Bill of Materials (BOM) for assembly. A thorough analysis of RF PCB materials is crucial to achieving high-quality and cost-effective production.

Understanding PCB Frequency Range

PCB frequency ranges can span from 0Hz to over 300GHz. PCBs with frequencies above 30MHz are considered high-frequency, while those exceeding 3GHz fall into the ultra-high-frequency category.

Is Material the Most Critical Factor in RF PCB?

Absolutely. The choice of RF material significantly influences the performance and cost of your RF PCB. Selecting a cost-effective material that meets electromagnetic frequency requirements is essential.

Differences Between RF PCB and Standard PCB

RF PCBs are crafted from high-frequency materials to support specific signal transmission needs, while standard PCBs use FR4 material to fulfill basic electronic functions.

RF vs. Microwave: What's the Difference?

RF, or radio frequency, encompasses a broad range from 30MHz to 300GHz. Microwave frequencies, a subset of RF, range from 1GHz to 100GHz, focusing on even shorter electromagnetic waves.