At LEAPPCB, we offer several types of via plugging to suit different PCB requirements, including conductive via plugs, non-conductive via plugs, and via plating shut by copper.

1. Via Tenting with LPI Solder Mask

   • Description: Plated through vias are covered with an LPI solder mask on one or both sides of the PCB during the solder mask printing process.
   • Advantages:
     • Cost-effective
     • Helps prevent solder leakage during SMT
     • Protects against dust and liquid ingress
   • Disadvantages:
     • Vias may not be fully covered
     • Not suitable for BGA areas
     • Best for vias under 0.3mm, with a maximum of 0.5mm

2. Via Plugging with Solder Mask

   • Description: An additional process where vias are specifically plugged with solder mask, either on one or both sides of the PCB.
   • Advantages:
     • Minimal additional cost
     • Nearly 100% via coverage
     • Effective in preventing solder leakage and contamination
   • Disadvantages:
     • Not ideal for BGA areas

3. Non-Conductive Via Plugging

   • Description: Vias are filled with non-conductive material, typically epoxy, ensuring complete coverage. This method is often used for BGA areas where space constraints require direct via drilling into BGA pads.
   • Advantages:
     • Completely prevents solder leakage and contamination
     • High stability and reliability
   • Disadvantages:
     • Additional cost
     • Requires experienced manufacturing and specialized equipment

4. Conductive Via Plugging

   • Description: Vias are filled with conductive material to ensure full plugging and enhanced thermal conductivity.
   • Advantages:
     • Excellent for heat dissipation
     • Improved current carrying capacity
     • Completely prevents solder leakage and contamination
     • High stability and reliability
   • Disadvantages:
     • Higher cost
     • Requires careful material selection to prevent via fracture

5. Via Plated Shut by Copper

   • Description: Instead of filling the vias with material, the vias are fully plated shut with copper. Due to the complexity and cost, this method is less commonly used.
   • Advantages:
     • Superior heat dissipation and current carrying capacity
     • Fully sealed to prevent solder leakage and contamination
     • Excellent stability and reliability
   • Disadvantages:
     • Very high cost
     • Limited by via size and copper thickness constraints

Each via plugging method has its specific advantages and is chosen based on the design requirements, reliability needs, and cost considerations of the PCB.